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HEIDENHAIN MULTI-DOF Technology Report

MULTI-DOF TECHNOLOGY from HEIDENHAIN has pushed the accuracy envelope below one micrometer. Through position feedback in multiple degrees of freedom, it achieves accuracies better than 200 nm while boosting dynamic performance.

This improved accuracy and speed translate into higher-performance products in the semiconductor and electronics industry, driving advancements in artificial intelligence, autonomous driving, humanoid robots and more. Ever higher accuracies in frontend and backend manufacturing processes, including advanced packaging and hybrid bonding, are giving rise to chiplet designs, faster processors and higher memory capacity within the chip industry.

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The positioning accuracy of manufacturing equipment can have a direct impact on product performance, especially within demanding industries such as semiconductors and electronics. Today's advances in processing speed and memory capacity are largely due to ever greater accuracy in frontend and backend chipmaking processes, including advanced packaging and hybrid bonding.

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